Products of other enterprises
Description
Recently in RF power device, packages are required to provide a measure to suppress high heating.
We developed and now release packages using Cu laminate H/S(CPC, SPC) that exceed traditional Cu/W & H/S in heat release.
We developed and now release packages using Cu laminate H/S(CPC, SPC) that exceed traditional Cu/W & H/S in heat release.
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RF power device