Precise DG Sphere Solders for BGA, CSP
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Seller
Malaysia, Bayan Lepas
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+60(
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Technical characteristics
- BrandPrecise
- Solder typeSoft
- Type of soft solderLead free
Description
The BGA (Ball Grid Array) packaging method is now drawing attention as the packaging & interconnection technology for Advanced Microelectronics.
NIHON HANDA has been supplying various kinds of solder preforms by DG-SOLDER being highly reputed for its excellent wettability and low void generation ratio for long time by their individual application field.
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Precise DG Sphere Solders for BGA, CSP
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