Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
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Description
Features | |
● | Y bonding area of 87mm, applicable lead frame width of 95mm achieved. |
● | Capable of high speed bonding of 50ms/2mm wire. |
● | Low inertia realized by the combination of short transducer and bond holder using CFRP, enabling to achieve high speed bonding. |
● | Bonding accuracy of ±2.0μm achieved by CFRP holder (low-thermal expansion) and high efficiency Z motor (low-heat-generating motor). |
● | Light and high rigidity XY table realized by Y motor using CFRP. |
● | Landing detection method at bonding is selectable between conventional positional detection mode and force detection mode |
● | High speed and yet stable operation achieved by adopting high performance DSP and CPU in control computer. |
● | Bond Inspection Measurement (BIM) System incorporated as a standard feature which feeds back the amount of deviation by measuring ball diameter and position. |
● | Automatic Free Air Ball Measurement (FAM) System incorporated as a standard feature. |
● | Shinkawa NRS technology incorporated to realize low vibration and high speed drive indispensable for fine pitch bonding. |
● | Shinkawa RPS technology (a technology which automatically calibrates offset between camera and capillary) |
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Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
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