Currency MYR
Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs buy in Subang Jaya
Buy Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs

Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs

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Malaysia, Subang Jaya
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Description
Features
Y bonding area of 87mm, applicable lead frame width of 95mm achieved.
Capable of high speed bonding of 50ms/2mm wire.
Low inertia realized by the combination of short transducer and bond holder using CFRP, enabling to achieve high speed bonding.
Bonding accuracy of ±2.0μm achieved by CFRP holder (low-thermal expansion) and high efficiency Z motor (low-heat-generating motor).
Light and high rigidity XY table realized by Y motor using CFRP.
Landing detection method at bonding is selectable between conventional positional detection mode and force detection mode
High speed and yet stable operation achieved by adopting high performance DSP and CPU in control computer.
Bond Inspection Measurement (BIM) System incorporated as a standard feature which feeds back the amount of deviation by measuring ball diameter and position.
Automatic Free Air Ball Measurement (FAM) System incorporated as a standard feature.
Shinkawa NRS technology incorporated to realize low vibration and high speed drive indispensable for fine pitch bonding.
Shinkawa RPS technology (a technology which automatically calibrates offset between camera and capillary)
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Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
Gold Wire Bonder for CSP, BGA, QFN, Leadframe Type ICs
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