EMI/RF Shielding Foils

From conventional cladding through precision electroformed systems, there are Oak-Mitsui foils for most applications:

• High Temperature elongation (HTE) foils for multilayer packages.
• Very low profile (VLP) foils for thin dielectrics and fine-line applications.
• Double-treated foils (DBT) for the assurance of factory bond strength on both sides.
• High ductility(HD) foils for flexible circuitry.
• Sophisticated treatments for PTFE, Polyimide, and various high Tg resins.
• Engineered foil/treatment systems for customer specific applications.