Chip-on-Board Adhesives

This is a one-component heat curable epoxy designed for encapsulation of IC in chip-on-board (COB) application. It has long pot life, is easy to use and has good physical properties after fully cured. It exhibits good adhesion on all types of PCB with high Tg, good thermal shock properties and water resistance. It can also be used in bonding of electornic parts, ceramics and metals.