Build-up PWBs (Laser)
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Description
- It is capable of mounting of CSP with the pad 0.5mm pitch.
- Using prepreg with woven glass cloth, it offers the excellent performance in bending strength test and drop impact test.
- The stack-via (Structure) is able to produce by Filled Copper Plating.
- Higher density assembly is available by means of fine patterning technologies.
- Including FR-4 base materials, most conventional CCLs and pre-pregs are applied for this PWB for the required performances.
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Build-up PWBs (Laser)
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